Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device
US7104312B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 30, 2003 |
| Grant date | Sep 12, 2006 |
| Priority date | — |
| Expiry date | Apr 22, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4935
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A method of controlling temperature of a heat source in contact with a heat exchanging surface of a heat exchanger, wherein the heat exchanging surface is substantially aligned along a plane. The method comprises channeling a first temperature fluid to the heat exchanging surface, wherein the first temperature fluid undergoes thermal exchange with the heat source along the heat exchanging surface. The method comprises channeling a second temperature fluid from the heat exchange surface, wherein fluid is channeled to minimize temperature differences along the heat source. The temperature differences are minimized by optimizing and controlling the fluidic and thermal resistances in the heat exchanger. The resistances to the fluid are influenced by size, volume and surface area of heat transferring features, multiple pumps, fixed and variable valves and flow impedance elements in the fluid path, pressure and flow rate control of the fluid, and other factors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.