Integrated circuit package socket and socket contact
US7104803B1 · kind B1 · utility
3Cited by
6References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2005 |
| Grant date | Sep 12, 2006 |
| Priority date | — |
| Expiry date | Mar 25, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1069
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An integrated circuit (IC) package socket is provided with an array of single-piece socket contact pins arranged to connect an IC package to a circuit board. The single-piece contact pin is supported at a middle portion of the contact pin and includes two acutely angled bends that allow the two ends of the contact pin to independently resiliently engage the package lands of the IC package and the contact pads of the circuit board. The contact pins are further shaped and arranged to laterally swipe the package lands and contact pads during engagement to scrape away or penetrate through any oxide or other contaminant buildup.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.