Method for producing ceramic substrate, and ceramic substrate
US7105070B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 8, 2004 |
| Grant date | Sep 12, 2006 |
| Priority date | — |
| Expiry date | Sep 8, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/308
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for producing a ceramic substrate which employs a cofiring process using restraint sheets in which a second ceramic green sheet 7 is laminated on a green ceramic substrate 30 so as to cover surface conductors 32 of the green ceramic substrate 30, the second ceramic green sheet 7 subsequently being integrated with the green ceramic substrate 30. Restraint sheets 9, which are not sintered at a sintering temperature at which the green ceramic substrate 30 is sintered, are laminated on corresponding opposite sides of the green ceramic substrate 30 so as to restrain the green ceramic substrate 30 together with the second ceramic green sheet 7. The second ceramic green sheet 7 and the green ceramic substrate 30 are fired at a temperature at which the second ceramic green sheet 7 and the green ceramic substrate 30 are integrally sintered, whereas the restraint sheets 9 are not sintered, to thereby yield a ceramic substrate 40. The restraint sheets 9 and a ceramic covering layer 7a which covers the surface conductors 32 are removed, to thereby expose the surface conductor layer 32. A plating layer 31 is formed on the surface conductor layer 32.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.