Polymer for photoresist and resin compositions therefor
US7105268B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 11, 2001 |
| Grant date | Sep 12, 2006 |
| Priority date | — |
| Expiry date | Jul 17, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/109
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A polymeric compound for photoresist of the invention includes at least one monomer unit represented by following Formula (I):wherein R1, R2, R3, R4 and R5 are the same or different and are each a hydrogen atom or a methyl group; m, p and q each denote an integer of from 0 to 2; and n denotes 0 or 1, where the hydroxyl group and carbonyloxy group extending from a principle chain in the formula are independently combined with either of two carbon atoms on the far-left portion of the rings.By using the polymeric compound for photoresist as a base of a photoresist, the resulting photoresist exhibits well-rounded adhesion to substrates and resistance to etching.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.