Resin aqueous dispersion composition
US7105597B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 16, 2002 |
| Grant date | Sep 12, 2006 |
| Priority date | — |
| Expiry date | Jul 16, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/03
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides a resin aqueous dispersion composition comprising water and at least one kind of resin particle, wherein when a primary average particle of each resin particle is taken as a sphere of the same volume, a nonionic surfactant is present in the composition in an amount which occupies 75 to 95% of a theoretical void among resin particles of 26% when each resin particle is arranged in a close packed structure. The nonionic surfactant is a solvent which is substantially nonvolatile in a temperature range of up to 100° C. and evaporates or thermally decomposes at a temperature lower than the thermal decomposition temperature of the resin particles. The resin aqueous dispersion composition can be coated thickly and can prevent development of mud crack.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.