Electrical device for interconnecting two printed circuit boards at a large distance
US7108567B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 7, 2005 |
| Grant date | Sep 19, 2006 |
| Priority date | — |
| Expiry date | Nov 7, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/6586
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electrical device (100) for interconnecting two parallel printed circuit boards at a large distance includes a plug connector (1), a receptacle connector (1′), and a mating extender (2) disposed between the plug connector and the receptacle connector. The mating extender includes a subassembly of wafer (21), a pair of identical caps (20) disposed on the top and bottom portions of the subassembly of wafer, and a pair of shroud-halves (22) sliding on the subassembly of the wafer. The subassembly of wafer is made up of a number of wafer modules (24) parallel with each other. Each wafer module has a wafer support (26) and a number of contacts (28) embedded in the wafer support.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.