Method of chemical mechanical polishing using abrasive particles of alkaline earth metal salts
US7108586B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 18, 2004 |
| Grant date | Sep 19, 2006 |
| Priority date | — |
| Expiry date | Aug 2, 2024 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09G1/02
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Particles of strontium carbonate, barium carbonate, strontium sulfate and/or barium sulfate having a sufficient degree of fineness, especially when produced synthetically, are suitable as abrasive agents in chemical mechanical polishing (CMP polishing) of components, e.g., microelectronic components such as silicon wafers. The alkaline earth metal salt compounds are used as slurries in water and/or organic liquids and optionally may contain a dispersing agent, and preferably have a pH value of at least 8.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.