Patent · US Expired

Method of chemical mechanical polishing using abrasive particles of alkaline earth metal salts

US7108586B2 · kind B2 · utility

0Cited by
8References
13Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 18, 2004
Grant dateSep 19, 2006
Priority date
Expiry dateAug 2, 2024

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC09G1/02
  • WIPO fieldBasic materials chemistry
  • WIPO sectorChemistry

Abstract

Particles of strontium carbonate, barium carbonate, strontium sulfate and/or barium sulfate having a sufficient degree of fineness, especially when produced synthetically, are suitable as abrasive agents in chemical mechanical polishing (CMP polishing) of components, e.g., microelectronic components such as silicon wafers. The alkaline earth metal salt compounds are used as slurries in water and/or organic liquids and optionally may contain a dispersing agent, and preferably have a pH value of at least 8.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.