Reworkable compositions incorporating episulfide resins
US7108920B1 · kind B1 · utility
3Cited by
9References
18Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Sep 15, 2000 |
| Grant date | Sep 19, 2006 |
| Priority date | — |
| Expiry date | Jan 3, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31515
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”), and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”), on a carrier substrate, as well as compounds useful in such compositions. The compositions include compounds having a thermally cleavable linkage, and include an episulfide group within the compound. The compositions of this invention are reworkable when subjected to appropriate conditions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.