Copper foil for printed circuit board with taking environmental conservation into consideration
US7108923B1 · kind B1 · utility
6Cited by
1References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 12, 2005 |
| Grant date | Sep 19, 2006 |
| Priority date | — |
| Expiry date | Oct 12, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A copper foil for a printed circuit board has a rust preventing layer formed by a trivalent chromium chemical conversion treatment on a surface of the copper foil that the copper foil is bonded to a base material for the printed circuit board. T copper foil is of copper or copper alloy, and the rust preventing layer contains 0.5 to 2.5 μg/cm2 of chromium converted into metallic chromium.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.