Space environmentally durable polyimides and copolyimides
US7109287B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 8, 2004 |
| Grant date | Sep 19, 2006 |
| Priority date | — |
| Expiry date | Mar 3, 2025 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G73/1067
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Polyimides displaying low color in thin films, atomic oxygen resistance, vacuum ultraviolet radiation resistance, solubility in organic solvents in the imide form, high glass transition (Tg) temperatures, and high thermal stability are provided. The poly(amide acid)s, copoly(amide acid)s, polyimides and copolyimides are prepared by the reaction of stoichiometric ratios of an aromatic dianhydride with diamines which contain phenylphosphine oxide groups in polar aprotic solvents. Controlled molecular weight oligomeric (amide acid)s and imides can be prepared by offsetting the stoichiometry according to the Carothers equation using excess diamine and endcapping with aromatic anhydrides. The polyimide materials can be processed into various material forms such as thin films, fibers, foams, threads, adhesive film, coatings, dry powders, and fiber coated prepreg, and uses include thin film membranes on antennas, second-surface mirrors, thermal optical coatings, and multi-layer thermal insulation (MLI) blanket materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.