Heat sinks
US7109520B2 · kind B2 · utility
29Cited by
20References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 10, 2003 |
| Grant date | Sep 19, 2006 |
| Priority date | — |
| Expiry date | Oct 10, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12044
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An aspect of the present invention provides a heat sink has a side with a pattern that extends at least partially through a thickness of the heat sink. The heat sink also has a thickness no greater than 9 mm. In another embodiment, a heat sink has a side with a pattern that extends at least partially through a thickness of the heat sink. The heat sink also has a ratio of area:thickness, as seen from a plan view, of at least 500:1 when the area and thickness are expressed in units of mm2 and mm, respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.