Semiconductor chip for optoelectronics and method for production thereof

US7109527B2 · kind B2 · utility

Assignee

• OSRAM GmbH · DE

Inventors

• Stefan Illek · Donaustauf, DE
• Andreas Plössl · Regensburg, DE
• Klaus Streubel · Hemau, DE
• Walter Wegleiter · Nittendorf, DE
• Ralph Wirth · Lappersdorf, DE

Key dates

• Filing date: Aug 8, 2001
• Grant date: Sep 19, 2006
• Expiry date: Aug 8, 2021

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/835

Abstract

A semiconductor chip, particularly a radiation-emitting semiconductor chip, comprises an active thin-film layer in which a photon-emitting zone is formed, and a carrier substrate for the thin-film layer is arranged at a side of the thin-film layer faces away from the emission direction and is connected to it. At least one cavity via which a plurality of mesas is fashioned at the boundary between carrier substrate and thin-film layer is fashioned in the active thin-film layer proceeding from the carrier substrate.