Integrated circuit with substantially perpendicular wire bonds
US7109589B2 · kind B2 · utility
1Cited by
13References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 26, 2004 |
| Grant date | Sep 19, 2006 |
| Priority date | — |
| Expiry date | Aug 26, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit comprises an integrated circuit package and a plurality of circuit elements disposed within the integrated circuit package. A plurality of wire bonds provide connections for at least one of the circuit elements. At least one wire bond in a first subset of wire bonds and at least one wire bond in a second subset of wire bonds are substantially perpendicular to one another at a crossing point of the wire bonds in a plan view of the integrated circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.