Semiconductor component comprising a surface metallization

US7109590B2 · kind B2 · utility

Assignee

• OSRAM GmbH · DE

Inventors

• Herbert Brunner · Sinzing, DE
• Thomas Hofer · Auenwald, DE
• Harald Jäger · Regensburg, DE

Key dates

• Filing date: May 10, 2001
• Grant date: Sep 19, 2006
• Expiry date: May 10, 2021

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P70/50
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The invention relates to a semiconductor component comprising surface metallization and having at least one semiconductor body (3) and a package base body (2) on whose surface conductor path structures (7) are formed by means of surface metallization. A subregion of the conductor path structure (7) constitutes the solder connections of the semiconductor component. The solder connections (1) are combined to form rows, the individual rows of solder connections being arranged at a very small, predetermined spacing from one another.