Method and apparatus for measuring structures in a fingerprint
US7110577B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 12, 1998 |
| Grant date | Sep 19, 2006 |
| Priority date | — |
| Expiry date | Jun 12, 2018 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61B5/1172
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Method and apparatus for the measuring of structures in a fingerprint or the like, comprising the measuring of chosen characteristics of the surface of the fingerprint, e.g. by measuring capacitance or resistivity, using a sensor array comprising a plurality of sensors, being positioned in contact with, or close to, a portion of the surface. The characteristics are measured in at least one line of measuring points along an elongated portion of the surface at given intervals of time, the sensor array being an essentially one-dimensional array, moving the surface in relation to the sensor array in a direction perpendicular to the sensor array, so that the measurements are performed at different, or partially overlapping, portions of the surface, combining the measurements of the measured portions of the surface to provide a segmented, two-dimensional representation of said characteristics of the surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.