Method of forming a head assembly
US7111383B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 22, 2003 |
| Grant date | Sep 26, 2006 |
| Priority date | — |
| Expiry date | Jan 11, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49055
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Methods of forming a head assembly, a head assembly, and a linear tape drive are provided. One aspect provides a method of forming a head assembly including providing a base member; forming a plurality of head components upon the base member individually adapted to communicate information relative to a tape; providing a plurality of component regions adjacent respective ones of the head components and a path of travel of the tape; and providing a support region intermediate adjacent ones of the head components and positioned to support the tape moving along the path of travel, the support region comprising a material different than a material of the component regions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.