Parts mounting and assembling apparatus
US7111390B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2004 |
| Grant date | Sep 26, 2006 |
| Priority date | — |
| Expiry date | Nov 25, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53417
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
An apparatus combining a high-speed high-precision characteristic equivalent to that of a die bonder and a flexibility of coping quickly with a process variation and product variation along with size reduction and economics. This apparatus comprises a base unit including a body containing a device to be used in common among a plurality of processes for mounting and assembling parts, a mechanism for conveying a workpiece in a predetermined conveying direction and a mechanism for positioning the workpiece, a dedicated unit including an end effector, and a selected mechanism unit including a mechanism for moving the end effector in two axial directions perpendicular to the predetermined conveying direction to adjust a relative position between the end effector and the workpiece or a part. The moving mechanism is interchangeably attached on the base unit, and the end effector is interchangeably attached on the moving mechanism.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.