Method and apparatus for making very low roughness copper foil
US7112271B2 · kind B2 · utility
8Cited by
3References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 28, 2003 |
| Grant date | Sep 26, 2006 |
| Priority date | — |
| Expiry date | Jul 28, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0355
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a very low roughness copper foil and an apparatus for manufacturing the copper foil. In the method of the present invention, a pickling process, an electrolytic polishing process and a washing process are successively performed after the copper foil was manufactured. In order to manufacture the very low roughness copper foil, the electrolytic polishing process is accomplished with the copper foil to face a metal cathode plate and supplying a current in order to perform the electrolytic polishing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.