Film deposition apparatus and film deposition method
US7112353B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 7, 2003 |
| Grant date | Sep 26, 2006 |
| Priority date | — |
| Expiry date | Jul 18, 2024 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/517
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A film deposition apparatus for forming a film on a substrate includes a chamber capable of maintaining a reduced-pressure atmosphere. The chamber includes a control electrode, a substrate holder opposite to the control electrode, the substrate holder holding the substrate, and a filament for emitting electrons disposed between the substrate holder and the control electrode. The film deposition apparatus further includes a unit for controlling the potential applied to the control electrode to be lower than the potential applied to the filament and a unit for controlling the potential applied to the substrate to be higher than the potential applied to the filament.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.