Thermosetting resin composition
US7112634B2 · kind B2 · utility
5Cited by
8References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 8, 2004 |
| Grant date | Sep 26, 2006 |
| Priority date | — |
| Expiry date | Oct 2, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thermosetting resin composition is produced by heat treating a mixture of a polyaddition thermosetting resin, a silicic compound of the formulawherein R is an organic group containing a functional group that causes an addition reaction with the curing agent and R5 and R6 are independently a methyl group or an ethyl group, and water and adding a curing agent of the polyaddition thermosetting resin to the mixture that has undergone heat treatment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.