Radiological image pickup apparatus
US7112800B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2004 |
| Grant date | Sep 26, 2006 |
| Priority date | — |
| Expiry date | Dec 1, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/803
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A portion corresponding to a surface lid section of a cabinet is formed using a nonconductive material. A structure is molded by using an insulating substance, an insulating plate member, and an insulating weir member so as to entirely cover a radiation-sensitive semiconductor and a voltage application electrode on an active matrix substrate. The area from the outer frame of the cabinet to the margin of the voltage application electrode is shielded by a shield member so as to cover any area, other than the portion just above the voltage application electrode, from above the insulating plate member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.