Optical device, optical module, semiconductor apparatus and its manufacturing method, and electronic apparatus
US7112863B2 · kind B2 · utility
9Cited by
9References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 14, 2004 |
| Grant date | Sep 26, 2006 |
| Priority date | — |
| Expiry date | Apr 14, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/811
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention provides an optical device that enables a mutual electrical connection between the stacked semiconductor substrates to be realized with ease and high reliability and to provide for miniaturization. The optical device has a first semiconductor substrate having an optical part and a first pad, a second semiconductor substrate having an integrated circuit and a second pad which is stacked under the first semiconductor substrate, a through-hole continuously extending through the first and the second semiconductor substrate, and a conductive part so formed as to include the inside of the through-hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.