Flip chip metal bonding to plastic leadframe
US7112873B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 3, 2004 |
| Grant date | Sep 26, 2006 |
| Priority date | — |
| Expiry date | Sep 3, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A plastic substrate can be provided and thereafter a plurality of metal-to-metal connections can be ultrasonically bonded to the plastic substrate. One or more dies and a plurality of conductive components thereof can then be respectively connected to the metal-to-metal connections in order to provide a plastic leadframe package structure that includes electronic circuitry thereon. The plurality of conductive components can be configured as discrete components, while the die itself can be configured as a Flip Chip On Plastic Leadframe component. By utilizing plastic as the basis for a substrate and, ultrasonic bonding of the metal-to-metal connections, a complex substrate formed from plastic can provide a structure, particularly a plastic leadframe structure, that allows for the use of parts and components that are much less expensive than presently utilized parts and components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.