Inspection system, inspection method, and method for manufacturing semiconductor device
US7112952B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 27, 2005 |
| Grant date | Sep 26, 2006 |
| Priority date | — |
| Expiry date | Jan 27, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/303
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention provides an inspection system of ID chips that can supply a signal or power supply voltage to an ID chip without contact, and can increase throughput of an inspection process and an inspection method using the inspection system. The inspection system according to the present invention includes a plurality of inspection electrodes, a plurality of inspection antennas, a position control unit, a unit for applying voltage to each of the inspection antennas, and a unit for measuring potentials of the inspection electrodes. One feature of the inspection system is that a plurality of ID chips and the plurality of inspection electrodes are overlapped with a certain space therebetween, and the plurality of ID chips and the plurality of inspection antennas are overlapped with a certain space therebetween, and the plurality of ID chips are interposed between the plurality of inspection electrodes and the plurality of inspection antennas by the position control unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.