Proble for testing integrated circuits
US7112974B1 · kind B1 · utility
9Cited by
12References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 23, 2002 |
| Grant date | Sep 26, 2006 |
| Priority date | — |
| Expiry date | Jan 6, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/06716
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
In one embodiment, a probe for testing integrated circuits includes a body having a tip and a hardening material on the tip. The hardening material helps improve the hardness of the tip. The hardening material thus allows the probe to reliably penetrate a layer to make a good electrical connection with a contact point under the layer, for example. In one embodiment, an electrically conductive coating is deposited over the hardening material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.