Testing arrangement to distribute integrated circuits
US7112979B2 · kind B2 · utility
6Cited by
14References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 23, 2002 |
| Grant date | Sep 26, 2006 |
| Priority date | — |
| Expiry date | Jul 23, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/31718
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Arrangements having integrated circuit (IC) voltage and thermal resistance designated on a per IC basis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.