Cooling device and apparatus and method for making the same
US7114256B2 · kind B2 · utility
Assignees
Inventor
Key dates
| Filing date | Sep 10, 2003 |
| Grant date | Oct 3, 2006 |
| Priority date | — |
| Expiry date | Sep 10, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53113
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cooling device (10) for heat dissipation for a heat-generating component includes a heat sink (14) and a heat pipe (13). The heat sink attached to the component includes a base (11) and a plurality of fins (12) extending from the base. A bottom portion of the heat pipe formed between the base and the fins, the remainder of the heat pipe formed through the fins. An apparatus for making the cooling device includes a mold (20) and a core (30) accommodated in the mold. The mold includes a base part (21) and a pair of symmetrical forming parts (22) slidably engaged on the base part. The forming parts defines a plurality of slots (222), a cavity (224), and a recess (225) respectively corresponding to the fins of the heat sink, the base of the heat sink, and the heat pipe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.