Low profile evaporative cooler housing
US7114346B2 · kind B2 · utility
4Cited by
19References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2003 |
| Grant date | Oct 3, 2006 |
| Priority date | — |
| Expiry date | Jul 2, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02B30/54
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A low profile evaporative cooler housing for attachment to a building includes a front panel, and an opposing rear panel that may have an extension that extends into a wall of the building. A first and second louver may extend between the front and rear panels.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.