Burn-in oven heat exchanger having improved thermal conduction
US7114556B2 · kind B2 · utility
4Cited by
27References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2002 |
| Grant date | Oct 3, 2006 |
| Priority date | — |
| Expiry date | Oct 7, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2862
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A heat exchange system that can accommodate a high power integrated circuit chip for burn-in temperature stressing includes a heat sink having a chip engaging surface that is adapted to engage a surface of the chip. A liquid layer fills a heat exchange gap between the surface of the chip and the chip engaging surface of the heat sink. The liquid layer provides a low thermal resistance juncture between the chip engaging surface of the heat sink and the surface of the chip, which allows for greater heat transfer therebetween.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.