Method and apparatus for mold clamping in an injection molding machine and the like
US7114949B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2005 |
| Grant date | Oct 3, 2006 |
| Priority date | — |
| Expiry date | Aug 27, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2945/76943
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Method for mold clamping of the present invention is capable of shortening a molding cycle without any initial setting works for an engaging position of a tie bars. The method is constituted the steps of moving the tie bars in the direction of mold closing during mold close operation, judging a relative moving speed between a movable die plate and the tie bar to be within a predetermined value, engaging the tie bars with the movable die plate mechanically by operating an engaging means when the relative moving speed is judged to be within the value, then further moving the movable die plate against a fixed die plate under engagement, and after contact of a movable mold with a fixed mold driving a mold clamping cylinder, thereby executing mold clamping operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.