Land grid array with socket plate
US7114959B2 · kind B2 · utility
8Cited by
6References
35Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 25, 2004 |
| Grant date | Oct 3, 2006 |
| Priority date | — |
| Expiry date | Aug 25, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R2201/20
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A grounded conductive plate in a land grid array package assembly includes a plurality of openings. The openings allow contacts from the socket to pass through to contact a package. The diameter of each opening is customizable to produce desired impedance between the contacts and the conductive plate. Impedance discontinuity seen by signals passing through the socket may be reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.