Method for fabricating light-emitting devices utilizing a photo-curable epoxy
US7115428B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 7, 2005 |
| Grant date | Oct 3, 2006 |
| Priority date | — |
| Expiry date | Apr 19, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0361
Abstract
A method for fabricating a light-emitting device is disclosed. A die that includes a semiconductor light emitting device is mounted on a carrier, the die having a face through which light is emitted. A mixture of photocurable epoxy and phosphor particles is dispensed on the face in a pattern that covers the face. The dispensed mixture is then irradiated with light to cure the epoxy in a time period that is less than the time period in which the phosphor particles settle. In one embodiment, the photocurable epoxy includes a UV curable epoxy. In one embodiment, the die includes sides through which some of the light is emitted and the mixture is allowed to run down the sides prior to being irradiated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.