Heat sink and electromagnetic interference reduction device
US7115817B2 · kind B2 · utility
1Cited by
55References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2002 |
| Grant date | Oct 3, 2006 |
| Priority date | — |
| Expiry date | Jul 20, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrical assembly comprising a circuit board an electrical device, and a heat dissipation device. The electrical device is capable of emitting thermal energy and electromagnetic interference (EMI). The electrical device is secured to the circuit board. The heat dissipation device is secured to the circuit board and is in thermal communication with the electrical device. The heat dissipation device also includes a continuous EMI fence and a plurality of fins disposed in a matrix orientation. The fins are spaced from one another to allow for efficient heat dissipation and have a substantially square cross-sectional shape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.