Radiation-emitting semiconductor component
US7115907B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2003 |
| Grant date | Oct 3, 2006 |
| Priority date | — |
| Expiry date | Sep 22, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/835
Abstract
A radiation-emitting semiconductor component with a layer structure (12) which includes a photon-emitting active layer (16), an n-doped cladding layer (14) and a p-doped cladding layer (18), a contact connected to the n-doped cladding layer (14) and a mirror layer (20) connected to the p-doped cladding layer (18). The mirror layer (20) is formed by an alloy of silver comprising one or more metals selected from the group consisting of Ru, Rh, Pd, Au, Os, Ir, Pt, Cu, Ti, Ta and Cr.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.