Method for modifying a stamping die to compensate for springback
US7117065B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2006 |
| Grant date | Oct 3, 2006 |
| Priority date | — |
| Expiry date | Mar 31, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
A method for modifying a stamping die to compensate for springback includes the steps of stamping a first part using a base, or pre-existing die set, and creating a surrogate die having the shape of the first stamped part. These steps are followed by simulated stamping of a blank with the surrogate die, where the blank is shaped according to the desired finished part. Then, the base die is modified by mapping the forming stresses, from the stamped blank, to an indicator blank, which is allowed to relax and then is employed as a template for modification of the base die. Following this, the accuracy of the newly modified base die is determined by stamping a second part in the modified base die and by comparing a number of dimensions of the second part with a number of corresponding dimensions of the desired finished part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.