Integrated pressure sensor and method of manufacture
US7117747B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 3, 2005 |
| Grant date | Oct 10, 2006 |
| Priority date | — |
| Expiry date | Jan 3, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L19/069
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A technique for manufacturing an integrated pressure sensor includes a number of steps. Initially, a substrate with conductive electrical traces located on first and second sides of the substrate is provided. A plurality of compensation circuits are positioned in an array on the first side of the substrate in electrical contact with one or more of the conductive electrical traces on the first side of the substrate. A plurality of pressure sensors are positioned on the second side of the substrate in electrical contact with one or more of the conductive electrical traces on the second side of the substrate. Each one of the sensors is associated with one of the compensation circuits to form a plurality of pressure sensor-compensation circuit pairs. The substrate includes conductive vias to electrically connect each of the sensor-compensation circuit pairs. Each of the compensation circuits provides temperature compensation for an associated one of the sensors. The sensor-compensation circuit pairs are calibrated and singulated for final packaging.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.