Grinding assembly of semiconductor wafer back-grinding apparatus and method of fastening a grinding plate to a grinding mount of the same
US7118465B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 8, 2005 |
| Grant date | Oct 10, 2006 |
| Priority date | — |
| Expiry date | Jul 8, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B45/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A semiconductor manufacturing apparatus includes a wafer support having a grinding base on which a wafer is disposed, and a grinding assembly disposed above the grinding base. The grinding assembly includes a grinding plate having grinding projections at the bottom thereof and at least two fixing pins protruding at a the top thereof, and a grinding mount to which the grinding plate to which the grinding plate can be initially coupled and then secured to quickly. The grinding mount has first fixing grooves in a bottom surface thereof and in which the respective fixing pins are inserted and held. A vacuum system and/or mechanical fasteners are used to then secure the grinding plate to the grinding mount.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.