Method of fabricating a composite carbon nanotube thermal interface device
US7118941B2 · kind B2 · utility
14Cited by
19References
35Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2003 |
| Grant date | Oct 10, 2006 |
| Priority date | — |
| Expiry date | Aug 16, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16195
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A composite carbon nanotube structure including a number of carbon nanotubes disposed in a metal matrix. The composite carbon nanotube structure may be used as a thermal interface device in a packaged integrated circuit device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.