Patent · US Expired

Wafer thinning using magnetic mirror plasma

US7118992B2 · kind B2 · utility

4Cited by

5References

20Claims

0Family size

Assignee

iFire Technologies, Inc. · US

Inventors

Terry R. Turner · Austin, US
James D. Spain · Georgetown, US
Richard Banks · Egham, GB

Key dates

Filing date	Aug 9, 2004
Grant date	Oct 10, 2006
Priority date	—
Expiry date	Aug 9, 2024

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10S438/977
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for manufacturing integrated circuits uses an atmospheric magnetic mirror plasma etching apparatus to thin a semiconductor wafer. In addition the process may, while thinning, both segregate and expose through-die vias for an integrated circuit chip. To segregate, the wafer may be partially diced. Then, the wafer may be tape laminated. Next, the backside of the wafer may be etched. As the backside material is removed, the partial dicing and through-die vias may be exposed. As such, the method reduced handling steps and increases yield. Furthermore, the method may be used in association with wafer level processing and flip chip with bump manufacturing.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.