Patent · US Expired

Solid-state semiconductor light emitting device

US7119422B2 · kind B2 · utility

79Cited by
2References
5Claims
0Family size

Assignee

Inventor

Key dates

Filing dateNov 15, 2004
Grant dateOct 10, 2006
Priority date
Expiry dateNov 15, 2024

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/0002

Abstract

A solid-state semiconductor light emitting device is disclosed. A heat sink that comprises a receiving cup for receiving a chip is provided. A leadframe that comprises a connection base is mounted above the heat sink, wherein the chip is connected to the leadframe via a metal wire and a resin or silicone is applied to cover all of them so as to form the a light emitting device that emits light. In the leadframe, two holders that include two top sides on their two top portions are opposite to one another, and a holder having holes is mounted between these two top sides. The holder having the holes is connected to one of these two opposite holders. A plastic material is applied to mold the three holders into the connection base for receiving the receiving cup of the heat sink. As a result, the heat sink provides with good heat-dissipating efficacy and each holder of the leadframe also provides with heat-dissipating efficacy and enhances connection stability as well.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.