Packaging for enhanced thermal and structural performance of electronic chip modules

US7119433B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• John Saunders Corbin, Jr. · Austin, US
• Gary F. Goth · Pleasant Valley, US
• Dales Morrison Kent · Round Rock, US
• William P. Kostenko · Poughkeepsie, US
• Roger R. Schmidt · Poughkeepsie, US
• John G. Torok · Poughkeepsie, US

Key dates

• Filing date: Jun 16, 2004
• Grant date: Oct 10, 2006
• Expiry date: Jun 16, 2024

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

In an integrated circuit packaging structure, such as in a SCM, DCM, or MCM, a method and apparatus for increasing heat spreader size and thus thermal performance is disclosed. The packaging structure includes a first substrate; an electronic device operably coupled to a top surface defining the first substrate; a heat spreader having a first surface operably coupled to a top surface defining the electronic device and an opposite second surface in thermal communication with a second substrate; and a frame defining an opening therethrough. The frame is further defined by an inwardly extending ledge configured to allow the heat spreader to extend at least to a peripheral edge defining a perimeter of the first substrate. In an exemplary embodiment, the second substrate includes one of a heat sink, cooling plate, thermal spreader, heat pipe, thermal hat, package lid, or other cooling member.