Assemblies for mounting electronic devices and associated heat sinks to computer modules and other structures
US7120027B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 8, 2004 |
| Grant date | Oct 10, 2006 |
| Priority date | — |
| Expiry date | Jun 13, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Structures and methods for mounting electronic devices and associated heat sinks to computer modules and other structures are described herein. In one embodiment, a structure for holding a heat sink in contact with an electronic device includes an electronic device holding portion and a heat sink holding portion. The electronic device holding portion is configured to support the electronic device, and the heat sink holding portion is configured to position the heat sink in contact with the electronic device. The structure can further include a spring holding portion configured to laterally support a coil spring. When the coil spring is laterally supported in the spring holding portion, the coil spring exerts a transverse compression force against the heat sink causing the heat sink to press against the electronic device with a uniform, or an approximately uniform, pressure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.