Method of making RFID device
US7120987B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 5, 2003 |
| Grant date | Oct 17, 2006 |
| Priority date | — |
| Expiry date | Jul 6, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A radio frequency identification (RFID) device includes a conductive pattern, such as an antenna, on one side of a substrate, and a chip, such as part of a strap, electrically coupled to the conductive pattern, and either on an opposite side of the substrate or on the same side of the substrate as the antenna. A method of fabricating the RFID device may include crimping the strap onto the substrate, in contact with a seed layer, which is subsequently used in forming the antenna or other conductive pattern by plating. The seed layer may be a patterned conductive ink layer. Alternatively, the seed layer may be a layer of conductive material deposited on the substrate, such as by vacuum deposition. Parts of the deposited layer may be covered with a patterned mask in order to form the desired configuration of the conductive pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.