Radiator sheet
US7121333B2 · kind B2 · utility
5Cited by
8References
4Claims
0Family size
Inventor
Key dates
| Filing date | Dec 30, 2004 |
| Grant date | Oct 17, 2006 |
| Priority date | — |
| Expiry date | Dec 30, 2024 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2275/04
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
The present invention relates to a radiator sheet improvement and more particularly to a structure with enhanced strength and increased heat exchange surface after assembling, which is achieved first by forming large holes and adjacent small holes on each radiator sheet, wherein a radiator tube passing through each large hole and a solder rod or tin solder inserted into each small hole, and then by using heat to melt solder to fill the space between the radiator sheet and the radiator tube, thereby enabling a firm bonding effect therebetween.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.