Method of applying an encapsulant material to an ink jet printhead
US7121647B2 · kind B2 · utility
3Cited by
34References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 2, 2003 |
| Grant date | Oct 17, 2006 |
| Priority date | — |
| Expiry date | May 27, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/1754
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A stencil printed encapsulant material is provided for use in protecting electrical components in thermal ink jet printhead cartridges. A method of applying an encapsulant material to an ink jet print cartridge by stencil printing is also provided. The method includes providing a stencil having at least one aperture, providing an ink jet cartridge and stencil printing an encapsulant material onto a portion of the ink jet print cartridge thereby forming a layer of encapsulant material to protect electrical components or other printhead components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.