Polyamide-imide resin solution and the use thereof for producing wire enamels
US7122244B2 · kind B2 · utility
1Cited by
9References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 27, 2001 |
| Grant date | Oct 17, 2006 |
| Priority date | — |
| Expiry date | Sep 20, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2969
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to a polyamideimide resin solution preparable by reacting (a) aromatic polycarboxylic acids and/or their anhydrides with (b) aromatic imide- and amide-forming components in cresol at temperatures above 170° C., to the use of this polyamideimide solution for the preparation of wire enamels, to the wire enamels in question, and to the enamelled wires coated therewith.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.