Patent · US Expired

Polyamide-imide resin solution and the use thereof for producing wire enamels

US7122244B2 · kind B2 · utility

1Cited by
9References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 27, 2001
Grant dateOct 17, 2006
Priority date
Expiry dateSep 20, 2021

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/2969
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

The present invention relates to a polyamideimide resin solution preparable by reacting (a) aromatic polycarboxylic acids and/or their anhydrides with (b) aromatic imide- and amide-forming components in cresol at temperatures above 170° C., to the use of this polyamideimide solution for the preparation of wire enamels, to the wire enamels in question, and to the enamelled wires coated therewith.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.