High-precision modeling filament
US7122246B2 · kind B2 · utility
149Cited by
17References
7Claims
0Family size
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Key dates
| Filing date | Feb 2, 2005 |
| Grant date | Oct 17, 2006 |
| Priority date | — |
| Expiry date | Feb 2, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/298
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Disclosed is a modeling filament for use as feedstock in a fused deposition modeling liquifier, and a method for manufacturing the filament. The diameter and standard deviation of the filament are controlled to meet various tolerance requirements of jam resistance, slip resistance, model strength, liquifier overflow prevention and hysteresis-free transient response. Standard deviation of the filament diameter is matched to a filament target diameter. The resulting filament is used to form high-quality models.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.