Composite resin particle with specific shape factor
US7122250B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2004 |
| Grant date | Oct 17, 2006 |
| Priority date | — |
| Expiry date | Apr 30, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2998
- WIPO fieldPharmaceuticals
- WIPO sectorChemistry
Abstract
The invention is a composite resin particle useful as an additive for paints or coatings, powder coatings, cosmetic additives, slush molding resins, spacer for electronic part assembly, standard particles for electric measurement devices, toner, hot melt adhesive as well as other molding materials. Said composite resin particle comprises a resin microparticle (A) depositing on the surface of a resin particle (B) wherein the shape factor (SF-1) of said composite resin particle is 115 to 800. It is also a composite resin particle comprising a resin microparticle (A) depositing on the surface of a resin particle (B) wherein the acid vale of a resin (b) constituting the resin particle (B) is 5 to 100.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.