Wiring board, stacked wiring board and method of manufacturing the same, semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
US7122909B2 · kind B2 · utility
0Cited by
4References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 1, 2004 |
| Grant date | Oct 17, 2006 |
| Priority date | — |
| Expiry date | Nov 25, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A wiring board has a substrate and an interconnect pattern formed on the substrate. The interconnect pattern includes a plurality of lands. Each of the lands includes a base section and an additional section extending from the base section, the base section of each of the lands having the same shape. When a spiral curve is rotated around an origin and disposed to pass over the base section, the additional section is formed to extend from the base section of any one of the lands in a direction along the spiral curve.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.