Heat sink for enhanced heat dissipation
US7124806B1 · kind B1 · utility
6Cited by
37References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 10, 2001 |
| Grant date | Oct 24, 2006 |
| Priority date | — |
| Expiry date | Dec 10, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat sink assembly includes a block formed of a thermally conductive material. For example, the thermally conductive material includes thermally conductive polymer. A heat conduit (e.g., a heat pipe) extends through a substantial portion of the block. In one example arrangement, airflow channels extend through portions of the block.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.